Study of Thickness and Grain Size Effects on Material Behavior in Micro Forming
學年 96
學期 2
出版(發表)日期 2008-05-01
作品名稱 Study of Thickness and Grain Size Effects on Material Behavior in Micro Forming
作品名稱(其他語言)
著者 Yeh, Fung-Huei; Li, Ching-Lun; Lu, Yuung-Hwa
單位 淡江大學機械與機電工程學系
出版者 Lausanne: Elsevier S.A.
著錄名稱、卷期、頁數 Journal of Materials Processing Technology 201(1-3), pp.237-241
摘要 With the development of the technology, miniature and portability become the trends in manufacturing business. It is more and more important to miniaturize blank size in micro-forming process as well. Therefore, the researchers of micro-forming focus on this trend and try their best to study the problems and find the best solution. This paper presents an effective and practical mathematical modeling to describe the material behavior of any thickness and any grain size in micro-forming. Using this modeling, the cylindrical micro-cup deep drawing is analyzed by explicit dynamic finite element method. The simulation results show that thickness variety and stress distribution are reasonable. This investigation proves that the new mathematical modeling of material behavior will supply a useful modeling which takes into account the thickness and grain size effects in micro-forming.
關鍵字 Thickness;Grain size;Material behavior;Micro-forming
語言 en
ISSN 0924-0136
期刊性質 國外
收錄於 SCI EI
產學合作
通訊作者 Yeh, Fung-Huei
審稿制度
國別 CHE
公開徵稿
出版型式 紙本
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