High power LED lighting assembly incorporated with a heat dissipation module with heat pipe
學年 95
學期 2
專利開始日期 2007-04-11
專利結束日期 2007-04-11
作品名稱 High power LED lighting assembly incorporated with a heat dissipation module with heat pipe
作品名稱（其他語言） 高功率發光二極體照明燈具與其散熱模組
著者 康尚文; Kang, Shung-wen; Tsai, Meng-chang; 簡坤誠; Chien, Kun-cheng
單位 淡江大學機械與機電工程學系
著錄名稱、卷期、頁數
描述 United States Patent: 7,581,856 Application number: 11/783,638 國際分類號：F21V 29/00 專利國別：美國
摘要 A high power light emitting diode (LED) lighting assembly incorporated with heat dissipation module is provided. The LED lighting assembly includes a heat exchange base, at least one LED array, at least one heat pipe and a heat dissipation module. The heat exchange base includes at least one LED configuration plan for mounting of the LED array and at least a hollow part for insertion of the heat pipe. The LED array is arranged at a predetermined projecting angle at the LED configuration plane. The heat pipe includes a heated section, a cooling section and a conducting section, and contains a working fluid therein. The heat exchange base is mounted to the heated section and the heat dissipation module is mounted to the cooling section. The thermal energy generated by the LEDs is conducted from the heat exchange base to the heated section of the heat pipe, whereby allowing the working fluid in the heat pipe to be heated and vaporized, and flows, from the conducting section to the cooling section for dissipation at the heat dissipation module.
關鍵字
語言 en
相關連結

機構典藏連結 ( http://tkuir.lib.tku.edu.tw:8080/dspace/handle/987654321/53860 )

機構典藏連結
SDGS 可負擔的潔淨能源,尊嚴就業與經濟發展