期刊論文

標題 Improvement of thickness uniformity in nickel electroforming for the LIGA process
學年 88
學期 2
出版(發表)日期 2000/05/01
作品名稱 Improvement of thickness uniformity in nickel electroforming for the LIGA process
作品名稱(其他語言)
著者 Yang, Hsiharng; 康尚文; Kang, Shung-wen
單位 淡江大學機械與機電工程學系
出版者 Elsevier
著錄名稱、卷期、頁數 international journal of machine tools and manufacture 40(7), pp.1065-1072
摘要 An effective method to improve thickness uniformity in nickel electroforming for the LIGA process to produce metallic microstructures is described. The deposited metal distribution is naturally a concave shape over the whole area of the plating base proved by experiments. The edge thickness of the plating area is usually twice or higher than the center of the plating area. A secondary cathode (guard ring) was applied to improve the electroform uniformity. The experimental result of a Joule–Thomson micro-cooler proved its feasibility. The thickness ratio of edge to center of a 500 μm sample decreased from 2.5 to 1.4. The thickness uniformity improvement is achieved without a loss in plating rate in the center of the features.
關鍵字 Thickness uniformity; Nickel electroforming; LIGA; Metallic microstructures
語言 英文
ISSN 0890-6955
期刊性質 國內
收錄於
產學合作
通訊作者
審稿制度
國別 中華民國
公開徵稿
出版型式 ,電子版