期刊論文
| 學年 | 98 |
|---|---|
| 學期 | 2 |
| 出版（發表）日期 | 2010-05-27 |
| 作品名稱 | Effect of weak reductant on properties of electroless copper polyacrylonitrile nanocomposites for electromagnetic interference shielding |
| 作品名稱（其他語言） | |
| 著者 | Tsao, Keng-Yu; Chen, Chang-Cheng; Huang, Chi-Yuan; Tsai, Ching-Shan; Yang, Sung-Yeng; Yeh, Jen-Taut; Chen , Kan-Nan |
| 單位 | 淡江大學化學學系 |
| 出版者 | Hoboken: John Wiley & Sons, Inc. |
| 著錄名稱、卷期、頁數 | Journal of Applied Polymer Science 118(2), pp. 936-942 |
| 摘要 | In this work, the electroless copper method with different reductant compositions (NaHSO3/Na2 S2O3·5H2O and Na2S2O3·5H2O) without sensitizing and activating, was used to deposit copper-sulfide deposition on the polyacrylonitrile (PAN) surface for electromagnetic interference (EMI) shielding materials. The weak reductant, NaHSO3, in the electroless copper method was used to control the phase of copper-sulfide deposition. The Cux(x=1–1.8)S was deposited on the PAN (CuxS-PAN) by reductant composition (NaHSO3/Na2S2O3·5H2O) and the Cux(x=1–1.8)S deposition of CuxS-PAN possesses three kinds of copper-sulfide phases (CuS, Cu1.75S and Cu1.8S). However, the electroless copper with reductant was only Na2S2O3·5H2O (without weak reductant, NaHSO3), the hexagonal CuS deposition was plated on the PAN (CuS-PAN) and increased the EMI shielding effectiveness of CuS-PAN composites about 10–15 dB. In this study, the best EMI SE of CuS-PAN and CuxS-PAN composites were about 27–30 dB and 15–17 dB respectively, as the cupric ion concentration was 0.24 M. The volume resistivity of CuS-PAN composite was about 1000 times lower than that of CuxS-PAN composite and lowest volume resistivity of CuS-PAN composites was 0.012 Ω cm, as the cupric ion concentration was 0.24 M. |
| 關鍵字 | EMI;electroless;CuS;polyacrylonitrile |
| 語言 | en |
| ISSN | 0021-8995 |
| 期刊性質 | 國外 |
| 收錄於 | SCI EI |
| 產學合作 | |
| 通訊作者 | Huang, Chi-Yuan |
| 審稿制度 | 是 |
| 國別 | USA |
| 公開徵稿 | |
| 出版型式 | 紙本 |
| 相關連結 |
機構典藏連結 ( http://tkuir.lib.tku.edu.tw:8080/dspace/handle/987654321/92077 ) |