期刊論文
| 學年 | 94 |
|---|---|
| 學期 | 2 |
| 出版（發表）日期 | 2006-06-01 |
| 作品名稱 | Effects of Nonionic Surfactants on Performance of Copper Chemical Mechanical Polishing |
| 作品名稱（其他語言） | |
| 著者 | Tsai, Tzu-hsuan; Wu, Y. F. |
| 單位 | 淡江大學化學工程與材料工程學系 |
| 出版者 | Philadelphia: Taylor & Francis Inc. |
| 著錄名稱、卷期、頁數 | Chemical Engineering Communications 193 (6), pp.702-714 |
| 摘要 | During copper chemical mechanical polishing (Cu-CMP), the physical properties of slurry, such as the dispersion and suspension stability of abrasives, the interaction between particles and the polished surface, and the rheological characteristics, greatly affect the planarization efficiency. In this study, several nonionic surfactants were added to change the aforementioned physical characteristics of slurry and Cu-CMP performance. Their effects were investigated. The experimental results showed that Al2O3 slurry with 300 ppm Triton DF-16 could enhance the wettability of the Cu surface and stabilize the dispersion of abrasives in the slurry. Therefore, the passivation reaction on the Cu surface during CMP would occur uniformly, and the removal of particles during post cleaning could be improved. Cu CMP using the slurry with an adequate amount of nonionic surfactants, Triton DF-16, is proposed to reduce the surface roughness, enhancing the planarity. |
| 關鍵字 | Chemical mechanical polishing;Copper;Nonionic surfactant;Stability;Viscosity;Wettability |
| 語言 | en |
| ISSN | 0098-6445 |
| 期刊性質 | 國外 |
| 收錄於 | SCI SSCI EI |
| 產學合作 | |
| 通訊作者 | Wu, Y. F. |
| 審稿制度 | |
| 國別 | USA |
| 公開徵稿 | |
| 出版型式 | 紙本 |
| 相關連結 |
機構典藏連結 ( http://tkuir.lib.tku.edu.tw:8080/dspace/handle/987654321/71794 ) |